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Principal Wet Process Engineer, Advanced Packaging at Micron

Department: HIG

Setup
On-site
Location
Boise, Idaho
Level
senior
Posted

Description

Micron Technology is seeking a Principal Wet Process Engineer to develop and optimize wet chemistry processes for advanced packaging products, improve product quality, yield, cost, productivity, and risk management, and resolve assembly process problems using failure analysis, FMEA, 8D, SPC/FDC, and related methodologies. The role also involves process and equipment evaluation, new-process qualification, supplier management, audits, and potentially automation and data-analysis projects. Candidates need an MS in a relevant field and at least 8 years of semiconductor process development experience; a PhD and advanced packaging or cleanroom experience are preferred.

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