Description
The role develops and optimizes chemical-mechanical polishing and fine-grinding processes for ZnSe, improves beveling and CNC milling, implements statistical process control and quality standards, manages polishing equipment and tooling, investigates defects with optical and electron-microscopy methods, and develops automation and safety procedures. It requires a bachelor’s degree in engineering and 1–3 years of experience in precision optics polishing, CMP, semiconductor wafer processing, or CNC precision machining, along with expertise in surface metrology, GD&T, abrasives, and optical standards.
