Description
The role develops and optimizes chemical-mechanical polishing and fine-grinding processes for ZnSe, improves beveling and CNC milling, implements statistical process control and quality standards, manages polishing equipment and tooling, performs defect and root-cause analysis, and develops automation and safety procedures. It requires a bachelor’s degree in engineering, 1–3 years of experience in precision optics polishing, CMP, semiconductor wafer processing, or CNC machining, and proficiency in surface engineering, metrology, GD&T, abrasives, and optical standards. The work is performed in a cleanroom or controlled laboratory environment and may involve chemical handling and cross-site collaboration in Asia and the United States.
