Description
NXP is seeking a Process Engineer to define and optimize semiconductor production procedures, maintain documentation and SOPs, lead root-cause analysis, dispose of quality-affected lots, support new-product introduction and process qualification, analyze production data, and collaborate on cost-reduction and continuous-improvement projects. The role requires 3–5 years of semiconductor process engineering experience involving wafer saw, blade dicing, backgrind, or DBG processes, along with a relevant engineering degree, data-analysis and problem-solving skills, and knowledge of SPC, process validation, Lean, Six Sigma, or continuous improvement.
