Description
The role is responsible for developing, optimizing, and maintaining semiconductor packaging assembly processes, including process flows, parameters, control plans, DOE experiments, process validation, and documentation. It also covers new materials, equipment, and process introductions, SPC and CPK analysis, yield and efficiency improvement, process and quality problem-solving, corrective and preventive actions, cost optimization, and support for APQP, PPAP, VDA6.3, customer audits, and quality-system activities. The position requires a bachelor's degree in a relevant field, at least three years of semiconductor packaging process experience, familiarity with packaging processes and quality tools, and strong communication and problem-solving skills.
