Description
Renesas Electronics is hiring a Process Engineer to develop, optimize, and sustain die-bond and wire-bond processes in semiconductor back-end assembly. The role focuses on process setup, yield improvement, troubleshooting, root-cause analysis, new-product introduction, process qualification, parameter control, statistical data analysis, and continuous improvement across production, quality, equipment, and R&D teams. Candidates need a bachelor’s degree in engineering, at least two years of semiconductor back-end assembly experience, and strong knowledge of die bonding and wire bonding.
