Description
PICA Product Development is seeking a Process Engineer to program, optimize, and sustain SMT and electronic assembly manufacturing processes in a high-mix PCB environment. The role covers pick-and-place, stencil and jet printer, and AOI programming; reflow oven profile development and thermal profiling; solder defect troubleshooting; NPI and process validation; yield and cycle-time improvement; IPC compliance; and cross-functional support with production, quality, and supply chain teams. Candidates need a bachelor’s degree in engineering or equivalent manufacturing experience, at least three years of electronics manufacturing experience, and hands-on SMT equipment and reflow profile experience.
