Description
STMicroelectronics is hiring for a process engineering role supporting the ramp-up of silicon carbide (SiC) semiconductor manufacturing in its new mass-production fab in Catania, Italy. The position is part of the Laser Splitting and Grinding Process Engineering team within the Finishing Module and focuses on hands-on process/tool work, troubleshooting, process qualification, supplier tool qualification, yield improvement, and collaboration with equipment engineers and R&D. The role requires a PhD or Master’s in a scientific discipline, strong English, attention to detail, and teamwork skills, and offers a €38,000–€45,000 gross annual salary plus variable pay, with hybrid work arrangements mentioned.
