Description
The role is responsible for sustaining, improving, and optimizing plating and resist-stripping processes in a high-volume semiconductor manufacturing environment. Responsibilities include daily engineering support, process-parameter monitoring, troubleshooting, root-cause analysis, yield and defect-reduction projects, process documentation, qualification, change management, and cross-functional collaboration. The position requires a bachelor’s degree in a relevant engineering discipline, 2–5 years of manufacturing or semiconductor process-engineering experience, and strong knowledge of process control, SPC, DOE, FMEA, and electroplating or wet-chemical processes.
