Description
Applied Materials is hiring a full-time Manager, Process Engineering (Electroplating) for its Singapore Advanced Packaging Development Center. The role leads the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging, manages a team of engineers, drives process innovation, supports customer engagements, and collaborates with global cross-functional teams. The position is based at Science Park II, with the office moving to Tampines in April 2027, and requires at least eight years of semiconductor process engineering experience, including electroplating or electrochemical deposition expertise.
