Summary from listing
The Process Assembly Technician will wire-bond focal plane arrays and perform piece-part handling, chemical handling, optical-microscope inspection, device assembly, testing, rework, and repair of electronic, optical, and mechanical assemblies. The role supports engineers and scientists, works with wiring and assembly drawings, operates manufacturing and process equipment, and may provide guidance to other technicians. It requires a high school diploma, at least two years of equivalent technical experience in wire-bonding, semiconductor device processing and testing, or semiconductor material handling, clean-room capability, and U.S. citizenship with an active or obtainable DOD security clearance. The position is primarily in a non-cleanroom area with secondary Class 100 semiconductor cleanroom work and follows a 9/80 schedule.
