Description
Micron Technology is hiring a Level 2 or 3 HBM Product Yield Enhancement PDFA Engineer in Boise, Idaho, to work on the Product Development Failure Analysis team. The role focuses on bringing next-generation HBM devices from design through qualification and mass production, identifying and resolving component-level failures, and improving yield, reliability, and product performance. Responsibilities include electrical, physical, and statistical failure analysis; root-cause investigation; data and AI-enabled analytics; collaboration with product, process, test, quality, and manufacturing teams; and supporting production ramp and reliability initiatives. The position requires a bachelor’s degree in a relevant engineering or science field, at least two years of semiconductor failure-analysis experience, and experience with AI, machine learning, or data-analytics tools.
