Description
GlobalFoundries is hiring a Quantum Advanced Packaging Manager to lead the advanced packaging team in Fab9 in Burlington, Vermont. The role focuses on developing cryogenic and superconducting capabilities, including wafer-to-wafer and die-to-wafer hybrid bonding, interposers, and related technologies. Responsibilities include team leadership, hiring and capability building, project execution, program planning, budget and resource management, vendor partnerships, cross-functional collaboration, and reporting to senior management. The position requires a master’s degree in a relevant engineering or materials science field, at least 10 years of related technical experience, and at least 2 years of technical leadership experience; a PhD and additional people-management experience are preferred. The expected salary range is $118,000 to $210,000.
