Description
GlobalFoundries Fab9 is hiring an R&D Assembly Engineer for its Quantum Advanced Packaging team. The role leads the development and integration of cryogenic and superconducting assembly processes for 2D, 2.5D, and 3D quantum packaging, including flip-chip, bump attach, die-to-wafer, wafer-to-wafer, and hybrid bonding. Responsibilities span process flow definition, prototype builds, yield and defect improvement, failure analysis, hardware bring-up and validation, tooling and materials development, and collaboration with quantum, packaging, cryogenic, test, and OSAT teams. The position requires a master’s degree in a relevant engineering or materials science field, at least 10 years of related work experience, strong technical troubleshooting and design-of-experiments skills, and English fluency; a PhD and additional leadership and project-management experience are preferred. The expected salary range is $118,000 to $210,000.
