Description
GlobalFoundries Fab9 is hiring an R&D Bump Process Engineer for its Quantum Advanced Packaging team. The role owns the development and integration of cryogenic and superconducting bumping processes, including interconnect materials, metallurgy, process windows, 2.5D/3D integration, yield improvement, failure analysis, and transition to pilot or high-volume manufacturing. The engineer will collaborate with device, cryogenic, packaging, reliability, test, and vendor teams and support quantum hardware packaging scaling. A master’s degree in a relevant engineering or materials science field and at least eight years of related work experience are required; the expected salary range is $98,000 to $176,000.
