Description
The Quantum Device Backend Engineer will prepare and inspect quantum processor dies, document defects, manage die and device inventory, hybridize devices with a flip-chip bump bonder, measure post-hybridization parameters, and develop backend processes with backend engineers. The role requires cleanroom and safety compliance and experience with microfabrication, photoresist stripping, optical inspection, die handling, and silicon wafers. Compensation is $99,000–$140,000 USD plus a 15% bonus target, equity, and benefits.
