Description
Micron is hiring a semiconductor yield and defect-analysis engineer to analyze defect data and equipment signals, identify root causes, and improve yield across DRAM and HBM process modules. The role involves FMEA, defect detection strategies, DOE and experiment analysis, SPC monitoring, yield characterization, and escalation of process issues. It requires a master’s degree in a relevant engineering or science field and expertise in device physics, DOE, SPC, semiconductor metrology, SEM, X-ray metrology, optical inspection, and Python.
