Description
Falcomm is hiring an RFIC Thermal Engineer to develop thermal models, run simulations, and optimize heat dissipation and thermal reliability for high-power RF integrated circuits, semiconductor packages, and modules. The role collaborates closely with RFIC design, packaging, and system teams, supports silicon validation and characterization, and documents analysis and recommendations. The position requires a bachelor’s degree in an engineering or computer-related field, 3–5 years of thermal analysis experience in semiconductor or electronic systems, and full-time onsite work in Atlanta, Georgia.
