Summary from listing
TSMC Japan 3DIC Research and Development Center is hiring a full-time semiconductor packaging engineer in Tsukuba, Ibaraki Prefecture. The role is assigned to one of four specialized positions: Package Substrate Development Engineer, Package Material Integration Engineer, Package Substrate Design for Manufacturing Engineer, or Package Substrate Process Engineer. Responsibilities include developing substrate prototypes, managing design rules and simulations, coordinating with suppliers, improving yield and reliability, and advancing next-generation packaging technologies. Candidates need at least three years of semiconductor industry experience, a bachelor’s, master’s, or doctoral degree, Japanese proficiency at N2 or above for non-native speakers, and TOEIC 650 or above (or 550 with professional English experience). The position is on-site, includes a three-month probationary period, and offers health insurance, pension benefits, and bonuses.
