Description
Renesas is seeking a Semiconductor Back-End Technology Development Engineer to develop and evaluate advanced packaging technologies such as FCCSP and FCBGA, improve assembly processes including molding, strip grinding, and package sawing, support production-line setup and mass production, and drive process quality and yield improvements. The role requires at least five years of semiconductor back-end technology development experience, including at least five years in molding, strip grinding, or package sawing, hands-on process improvement and quality-control experience, and a bachelor’s degree in a technical field. Japanese business-level proficiency and approximately TOEIC 700-level English are required, while experience with AI/HPC packages, advanced packaging technologies, and ISO or IATF quality standards is preferred. The position follows a hybrid model with two remote work days per week.
