Description
Renesas is seeking a Semiconductor Back-End Technology Development Engineer to develop and evaluate advanced packaging technologies such as FCCSP and FCBGA, improve assembly and material processes, support production-line setup and mass production, and drive quality and yield improvements. The role requires at least five years of semiconductor back-end technology development experience, including molding, strip grinding, or package sawing, along with a bachelor’s degree in a technical field and Japanese and English communication skills.
