Description
Renesas is hiring a Semiconductor Back-End Wire Bonding Engineer to work on back-end manufacturing operations, evaluate and improve wire-bonding processes, support product launches, and contribute to quality improvements. The role requires semiconductor back-end wire-bonding experience, equipment-operation knowledge, process-evaluation skills, understanding of the full back-end process sequence, and the ability to prepare and present evaluation reports; knowledge of automation, AMR, and AI is desired. The position follows a hybrid work model with remote work two days per week and in-office collaboration on Tuesdays through Thursdays.
