Description
Universal Quantum is seeking a Semiconductor Package Development Engineer to join their team in Japan. The successful candidate will focus on developing advanced semiconductor packaging solutions for next-generation quantum microchips, leveraging ceramic package technology. Responsibilities include initiating packaging concepts, driving methodology and innovation, improving productivity, and developing packages for testing in extreme environments like cryogenic conditions. The role requires strong communication skills in Japanese and English, along with expertise in package design, micro-assembly, and simulation.
