Description
Universal Quantum is hiring a Semiconductor Package Development Engineer to develop advanced semiconductor packaging solutions for next-generation quantum microchips. The role involves initiating packaging concepts, advancing IC package development with ceramic package technology, improving development methodology and productivity, developing packages for cryogenic and low-vacuum testing, and collaborating with internal teams and external vendors. The position requires strong Japanese and English communication, semiconductor packaging experience, micro-assembly and materials-processing knowledge, CAD and thermo-mechanical simulation skills, FEM analysis, IC packaging testing methodology, reliability and failure-mechanism expertise, and a PhD or senior expertise in a relevant engineering or science field.
