Description
Sigma Design is hiring a Semiconductor Packaging Engineer in Redmond, Washington for an in-office contract role expected to last 12 months with a possible extension. The role focuses on developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes for heterogeneous, flexible, and stretchable electronic systems, working closely with research, hardware, manufacturing, and external partners. The posting highlights extensive hands-on packaging/process experience, DOE and yield optimization, advanced packaging technologies such as SMT, die/wire bonding, 2.5D/3D integration, SiP/MCM, and related fabrication, characterization, and reliability testing skills, along with a bachelor’s degree in a related engineering or science field and at least 1 year of relevant experience preferred.
