Description
onsemi is hiring a Semiconductor Packaging Modeling and Simulation Engineer in Waterloo, Ontario, to support power module development, product design, assembly and process, quality, reliability, and customer work. The role performs thermal-mechanical simulation of microelectronic packaging and systems, analyzes reliability issues, correlates models with measurements, develops simulation methodologies including digital twins, AI, machine learning, crystal plasticity, and Ag/Cu sintering models, and maintains the modeling software environment. Candidates need a master's or PhD in a relevant field, 2–3+ years of relevant experience, expertise in thermal-mechanical modeling, solid mechanics, fracture mechanics, delamination, semiconductor packaging, ANSYS, and Linux, along with strong communication and learning skills. The base salary range is $76,900 to $127,000, excluding fringe benefits or potential bonuses.
