Description
Lockheed Martin is hiring a Semiconductor Process Engineering Manager for its Advanced Focal Plane Array Production Team in Goleta, California. The role leads a high-mix production team responsible for infrared sensor array manufacturing, including wicking, plasma cleaning, wirebonding, substrate thinning, dicing, AR coating, and flip-chip bonding. Responsibilities include developing and optimizing process flows and equipment, improving yield and throughput, leading capital procurement, analyzing test data, and maintaining process documentation. The position requires a bachelor’s degree in engineering, physics, or a related field, at least eight years of semiconductor packaging or FPA manufacturing experience, and at least five years of technical team leadership experience. The full-time salary range is $166,900 to $309,900, with medical, dental, vision, flexible scheduling, retirement matching, paid time off, and other benefits.
