Description
Axelera AI is hiring a Senior Advanced Packaging & Power Delivery Engineer to own power-delivery design across on-die power grids, package and PCB PDNs, and advanced 2.5D/3D packaging architectures for AI accelerators. The role leads SI/PI verification, packaging integration, thermal reviews, design methodologies, risk mitigation, and collaboration with silicon, AIIS, and external packaging partners. Candidates need a bachelor’s or master’s degree in electrical engineering, microelectronics, or a related field, at least seven years of relevant semiconductor or deep-tech experience, and expertise in advanced packaging and power-integrity tools. The position offers flexible European work arrangements, including offices in Belgium, the Netherlands, Switzerland, Italy, and the United Kingdom, or fully remote work from an eligible European country.
