Description
Draper is hiring a Senior Advanced Packaging/MEMS Process Engineer in St. Petersburg, Florida, to develop and qualify copper electroplating, etch, sputter, metrology, and other semiconductor and MEMS fabrication processes for HSIP and FOWL technologies. The role supports high-mix, low-volume manufacturing readiness for 2.5D/3D chiplet integration, troubleshoots process issues, improves yield and reliability, mentors engineers, and requires a U.S. security clearance. A bachelor's degree in Electrical Engineering, Mechanical Engineering, or Physics is required, with a master's degree preferred, and 5–10 years of Microsystems Engineering or related experience.
