Department: SiliconEducation: education_required
Compensation · Listed in posting
$180,000 – $260,000/yr
K2 is hiring a Senior ASIC Package Design Engineer to define and deliver advanced flip-chip BGA and multi-chip module package architectures for high-performance mixed-signal and digital SoCs. The role covers package trade studies, substrate and signal/power integrity design, thermal architecture, vendor and OSAT management, and qualification through production ramp, with a base salary of $180,000–$260,000 plus equity and comprehensive benefits.
Every query opens live roles, salary samples, and market demand — tap a search to run it instantly.
Unlock powerful job search, personalized recommendations, and deep career insights from comprehensive, market-leading data and live market signals.
For job seekers
Upload your résumé, start a Job Search Thread, and let Metaintro rank real openings against your experience — then guide you from search to offer.
Match
Compare live roles against your current evidence.
Position
Turn proof projects into role-specific applications.
Improve
Use market feedback to keep the skill plan current.
.png&sig=v2nZgYYThDFAC_8jnYeiVwyQg_jPWWPnfKl3Nm6H2y4)
Aerospace and DefenseTorrance, CA11-50
Building the largest satellites in orbit. Ultra-powerful, scalable platforms engineered for LEO, MEO, GEO and cislunar missions. Explore the next-generation of satellites.