Description
Micron Technology is hiring an HBM Datapath Architect to design, optimize, and integrate high-speed datapath circuitry for JEDEC and custom High Bandwidth Memory products. The role defines system requirements, coordinates subsystem design across design, PHY, ECC, verification, layout, and system engineering teams, supports silicon bring-up, and resolves design and program-support issues. Candidates need a bachelor’s degree with four years of relevant experience or a master’s degree with two years, plus experience with high-speed datapath circuitry, hardware/software specifications, and subsystem integration.
