Senior Director, Package Design Engineering at RenesasElectronics

Seniority in posting: executive

Setup: Hybrid
Location: Austin, Texas
Type: Full-time
Level: lead/mgmt
Posted: Sep 27, 2026

Description

Renesas Electronics is hiring a Sr. Director, Technical Program Management to lead a global TPM organization supporting AI and datacenter infrastructure power NPI and package engineering programs. The role partners with package engineering, product, reliability, quality, operations, supply chain, and OSAT/CM partners; establishes NPI governance, risk and issue management, dashboards, and standardized processes; leads cross-functional task forces; manages OSAT development and production ramp activities; and develops a high-performing global TPM team. The position requires a technical degree and 15–20+ years of relevant semiconductor, package development, NPI, manufacturing, or program management experience, along with expertise in power management products, OSAT/CM collaboration, and complex technical issue resolution.

Required Skills

Program management
Risk management
Root-cause analysis
OSAT/CM management
Reliability
Critical-path management
Executive presentation

Additional Information

Minimum Education: Doctorate, Master’s, or Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline
Required Previous Experiences: 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field
Experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp
Experience with power management products, including power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management systems, PMICs, and wafer-level or flip-chip technologies
Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations
Experience leading cross-functional technical task forces and resolving complex quality, reliability, yield, manufacturability, and schedule issues
Experience building and leading global teams, including teams embedded at external manufacturing or OSAT locations
Preferred Qualifications: Experience supporting high-growth customer programs
Experience with Smart Power Stage, Vertical Power Stage, power module, discrete FET, SiC/GaN, DBC/AMB, multi-chip, wafer-level, or advanced interconnect technologies
Experience with formal technical program management methodologies and portfolio-level governance
Experience driving customer-critical NPI programs in a fast-paced, high-growth environment
Translation Company Name: Renesas Electronics