Description
Micron is hiring an Advanced Packaging Integration Engineer for its Advanced Packaging Technology Development team. The role develops and enables advanced semiconductor packaging technologies, improves yield, quality, cost, productivity, and reliability, coordinates technology transfer to manufacturing, and integrates AI-enabled tools. Candidates need a PhD or master’s degree with at least three years of relevant experience, or a bachelor’s degree with at least five years of relevant experience, along with semiconductor process integration experience and proficiency in Python, R, SQL, Visual Basic, and semiconductor process-control systems.
