Description
Micron is hiring an Advanced Packaging Integration Engineer for its Advanced Packaging Technology Development team. The role develops and enables advanced semiconductor packaging technologies, improves yield, quality, cost, productivity, and reliability, and coordinates technology transfer from development through high-volume manufacturing. Responsibilities include post-fab wafer finish and assembly integration, data and statistical analysis, process modeling, defect analysis, AI-enabled improvements, and collaboration with process, product, test, quality, and manufacturing teams. Candidates need a PhD or master’s degree with at least three years of relevant experience, or a bachelor’s degree with at least five years of relevant experience, along with semiconductor process integration experience and proficiency in Python, R, SQL, Visual Basic, and semiconductor process-control tools.
