Description
Micron Technology is seeking an IC Package Integration Engineer to develop and execute test-vehicle strategies for characterizing critical package integration behaviors, support virtual prototyping and multi-physics simulation, define design rules and manufacturing-ready processes, and collaborate with silicon, package, fab, and manufacturing teams. The role requires IC-package development knowledge, test-vehicle strategy execution, cross-functional coordination, analytical problem-solving, and strong English communication; semiconductor fabrication, AI/ML tools, and relevant engineering education are preferred.
