Description
Micron Technology, Inc. is hiring a FE CPIE CPI PI Senior Engineer to drive packaging product yield, quality improvement, and new product introduction across the global network. The role leads PI Loop and cross-functional teams, develops packaging and front-end manufacturing strategies, optimizes process flows, and applies AI-enabled engineering, advanced analytics, automation, and digital tools to improve productivity and decision quality. The position requires a bachelor’s or master’s degree in a relevant technical field, five years of semiconductor device physics and DRAM fabrication experience, three years of DRAM high-performance memory and advanced packaging experience, and travel to Micron fab locations 20–50% of the time.
