Description
ASM is hiring a Senior Process Engineer to advance semiconductor process technologies, with a focus on advanced packaging, thin-film deposition, surface preparation, hybrid bonding, materials characterization, DOE/RSM experiments, equipment troubleshooting, customer demonstrations, and technical problem solving. The role may supervise process engineering technicians, requires a bachelor’s, master’s, or PhD in a relevant field, at least 10 years of combined education, research, and work experience, and direct experience with D2W/W2W hybrid bonding. The position may involve up to 10% travel to remote sites and customer engagements.
