Description
Microchip Technology Inc. is hiring a Power Module Design Engineer at its Caldicot site to research, design, develop, and evaluate advanced Si and SiC power module packaging concepts. The role leads electrical design and simulation, including schematics, layouts, switching and electromagnetic performance analysis, thermal evaluation, component selection, prototype testing, and technical documentation. Candidates need a bachelor’s or master’s degree in electrical engineering or a related field, at least three years of power module design experience, and proficiency with Altium Designer, SPICE, PLECS, ANSYS Q3D, ANSYS Maxwell, and ANSYS Icepak. The position offers flexible working arrangements, international travel of 0–25%, and an attractive benefits package.
