Description
ASM is hiring a Senior Engineer, Process Engineering to develop, qualify, and support customer adoption of thin-film deposition solutions for semiconductor packaging. The role leads hardware and process qualification, plasma etching, cleaning, and deposition process development, customer demonstrations, troubleshooting, escalations, and cross-functional product improvement work. It is based in Hsinchu, Taichung, Tainan, or Kaohsiung, with approximately 30% travel outside Taiwan and potential relocation to the United States after 1–2 years.
