Description
ASM is hiring a Senior Process Engineer in Advanced Packaging to contribute to the research, development, and optimization of semiconductor process technologies, including thin-film deposition and surface preparation. The role involves designing and analyzing DOE-based experiments, characterizing materials and processes, troubleshooting laboratory and pilot equipment, documenting results, and supporting the transition of processes into customer and manufacturing environments. Candidates need a PhD in a relevant engineering or science field, hands-on thin-film deposition research experience, strong experimental and analytical skills, and familiarity with semiconductor manufacturing and materials characterization methods.
