Description
Micron Technology is hiring a Senior Engineer in Boise, Idaho to develop VSM, CM, and DT models across wafer, die, and package technology nodes. The role involves collaborating with global teams, deploying advanced modeling solutions, applying computational and generative AI techniques, interpreting predictive modeling insights, and communicating findings to engineering teams and senior leaders. Candidates need a master’s degree with 3+ years of experience or a PhD with 1+ years of experience, along with expertise in numerical methods, high-performance computing, machine learning, artificial intelligence, multiphysics and multiscale modeling, and programming in Linux, C++, and Python.
