Description
Infineon is hiring a Senior Engineer, Unit Process Development, Singulations for its Research & Development team. The role leads process development for semiconductor package singulation technologies, including tape-based, tapeless, and laser singulation; drives qualification, industrialization, yield improvement, documentation, supplier verification, and technology readiness; and provides technical leadership to engineering and project teams. The position requires at least 10 years of semiconductor backend assembly and package development experience, including 5 years in package singulation process development, along with strong technical leadership, analytical, stakeholder-management, and roadmap-planning capabilities.
