Description
Infineon is hiring a Senior Engineer focused on UPD laser marking and singulation to lead the development of scalable semiconductor packaging solutions. The role covers process development, qualification, industrialization, yield improvement, technology readiness, supplier and tooling verification, documentation, and technical guidance for operations and project teams. Candidates need a bachelor's or master's degree in engineering or a relevant field, at least 10 years of semiconductor backend assembly and package development experience, and at least 5 years of direct package singulation and laser marking process development experience.
