Description
The Semiconductor Failure Analysis Engineer performs sample preparation and imaging for package-level electrical failure analysis and die-level physical failure analysis, including die extraction, layer-by-layer polishing, chemical processing, RIE, SEM/EDX, and backside IR. The role also documents analysis results, develops new failure-analysis techniques and recipes, evaluates tools for emerging technologies, and requires knowledge of semiconductor manufacturing processes. Candidates need a bachelor’s or master’s degree in a relevant field, at least three years of semiconductor manufacturing or R&D experience, and hands-on experience with failure-analysis sample-preparation tools.
