Description
TEL Technology Center, America (TTCA) is seeking a Senior Heterogeneous Integration Process Engineer to lead R&D programs in advanced 3DI technologies like C2W, D2W, and wafer bonding. The role involves defining technical strategies, collaborating globally, conducting fundamental research, evaluating technology feasibility, and mentoring researchers. The successful candidate will drive technology pathfinding for heterogeneous and 3D device integration, providing technical leadership for customer engagements and internal development programs.
