Description
Micron Technology, Inc. is hiring a Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer for its Global Quality DRAM/Emerging Memory Quality and Reliability Assurance team. The role performs electrical characterization and failure analysis of HBM products, distinguishes package- versus device-related failures, uses semiconductor test and layout tools, documents and categorizes failures, coordinates with reliability and product engineering groups, supports equipment and user training, and applies AI to improve failure analysis workflows. The position requires a bachelor’s degree in electrical, electronics, or computer engineering, at least five years of semiconductor experience, and knowledge of DRAM, fabrication, device physics, and failure analysis.
