Description
The role leads customer integration, technical engagement, system engineering, HBM architecture, packaging, manufacturing, and customer enablement. It partners with design, product, manufacturing, and system engineering teams; establishes governance and executive communications; resolves complex technical issues; and develops AI systems to automate processes. The position requires a BS or MS in electrical or computer engineering or a related field, at least 10 years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience, and the ability to lead global cross-functional teams and influence executive stakeholders.
