Senior Manager, Semiconductor IC Packaging & Assembly Engineering at RenesasElectronics

Seniority in posting: senior

Setup: On-site
Location: Hang Tuah Jaya Municipal Council, Malacca
Type: Full-time
Level: lead/mgmt
Posted: Sep 24, 2026

Description

Renesas Electronics is hiring a Senior Manager of Semiconductor IC Packaging Assembly Engineering to support sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies, including AI and data center power packaging, wide-bandgap devices, and advanced interconnects. The role leads yield monitoring, quality and reliability management, process change management, NPI-to-HVM ramp execution, and global OSAT partner management while providing technical guidance and mentoring to the assembly engineering team.

Required Skills

Packaging assembly
Yield analysis
SPC
DOE
Reliability
Process control
OSAT management
NPI-to-HVM

Additional Information

Minimum Education: Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline
Required Previous Experiences: 15+ years of semiconductor manufacturing and packaging engineering experience, including IC assembly, package development, qualification, and NPI-to-HVM transfers
3+ years leading technical projects, mentoring engineers, or managing small engineering teams in semiconductor manufacturing environments
Experience working with global OSAT partners and outsourced manufacturing ecosystems
Experience supporting successful NPI-to-HVM product ramp execution
Preferred Qualifications: Master’s degree or PhD in Engineering or a related field
Experience with advanced power-package technologies, including SiP, multi-chip modules, Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages
Wafer-level and substrate-level packaging design and technology knowledge
Wide-bandgap packaging knowledge for SiC and GaN, including DBC, AMB, and advanced interconnect technologies
2.5D/3D packaging, fan-out, embedded die, and heterogeneous integration
Familiarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap manufacturing requirements
Experience with geographically distributed engineering teams and global manufacturing operations
Knowledge of JEDEC, IPC, and customer qualification reliability standards
Translation Company Name: Renesas Electronics