Description
NVIDIA is hiring a Senior Package Layout Engineer to design and develop detailed layouts for IC substrates and high-speed, high-density ASIC packages. The role collaborates with technical package leads and design teams to perform substrate breakout patterns, optimize pinouts, route and place components, manage stack-up and power distribution, resolve manufacturing and electrical issues, conduct feasibility studies, develop CAD libraries, and improve layout productivity. Candidates need an electrical engineering degree or equivalent experience, at least five years of PCB layout experience, and significant Cadence APD or SiP tool experience; the posting is hybrid and applications were accepted through September 26, 2026.
