Description
NVIDIA is hiring a Senior Package Modeling Engineer in its Advanced Technology Group to conduct finite element analysis of stress, warpage, and thermo-mechanical behavior in advanced semiconductor packaging. The role evaluates materials, interconnect concepts, and process options; analyzes material properties and reliability; develops modeling approaches; mentors cross-functional teams; and documents methodologies. Candidates need a master's or PhD in mechanical engineering, materials science, or a related field, at least five years of FEA modeling experience, expertise in tools such as ANSYS, Abaqus, or COMSOL, and knowledge of semiconductor packaging architectures and reliability standards. The role is hybrid and offers a base salary of 124,000–195,500 USD for Level 3 and 140,000–224,250 USD for Level 4, plus equity and benefits.
